Technological data concerning the production of PCBs
in Basista Printed Circuit Boards company
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III. Double- sided boards with metalization.
3.1 Data concerning mechanical treatment
1.Maximum dimensions of printed circuit board 465 x 583 mm
2. Standard laminate thickness:
0.80 mm, 1.00 mm, 1.20 mm, 1.55 mm, 2.00 mm, 2.40 mm2.1 Other thickness - on request 0.55 mm, 3.20 mm
(thickness of laminate other than 1,55mm is available for prototype orders and short batches of products as standard, whereas in case of longer batches of products, Basista Printed Circuit Boards has to be contacted in advance and asked about the feasible term of completion of a non-standard order).
3. Standard cooper thickness Double - sided PCBs 18 µm
Single - sided PCBs 35 µm
3.1 Others - on request
4. Maximum bending and twist of printed circuit boards from 0,2 % to 2%
according to IPC - D - 300 standard
5. Tolerances
5.1 Routing +/- 0,10 mm
a) Standard contour routing / cutter diameter - 2 mm
b) All tracks should be placed 0,2 mm (as minimum) from the board edge.
5.2 Scribing - CNC technology
a) Minimum distance between copper (tracks, pads etc.) and the scribing line is 0,4 mm.
1. Drilling accuracy +/- 0,05 mm [2 mils]
2. Minimum hole diameter for standard PCBs = 0.20 mm
(thickness of laminate up to 1,55 mm)3.Minimum standard hole diameter = 0.30 mm
4.Tolerance of non-plated holes +/- 0,10 mm
5. Tolerance of metal – plated holes – all diameters + 0.10 mm / -0.05 mm
6.All holes bigger than 6 mm are routed
1. Minimum pad diameter hole diameter + 0,3 mm (2x150µm )
3.4 Critical values (the minimum) for feasible PCBs
|
PCB’s component |
Symbol on the drawingg |
Cu=18 m m |
Cu=35 m m |
Cu=70 m m |
Cu=105 m m |
|
Pad/Pad |
"A" |
4 mils |
5 mils |
8 mils |
8 mils |
|
Pad/Track |
"B" |
4 mils |
5 mils |
8 mils |
8 mils |
|
Track/Track |
"C" |
4 mils |
5 mils |
8 mils |
8 mils |
|
Minimum track |
"D" |
5 mils |
6 mils |
10 mils |
12 mils |
3.5 Soldering mask
The following drawings show the correct and incorrect method of preparing a layer with a silkscreen
Incorrect: Correct:
|
A silkscreen that is written over the soldering points will be always removed by ClipSilkScreen function |
View of the description after ClipSilkScreen operation (i.e. after removal from the pads’ area):
Before: After:
3.8. Graphite paste is applied with use of silk-screen printing method
The elements on the graphite mask should be increased by 10 mils in relation to the elements of the mosaic.
The uncovered place on the mask has to expose the whole area of a graphite element!
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